About
I am a 4th year Ph.D. candidate at MIT, co-advised by Tomás Palacios and Ruonan Han. I'm interested in advancing 3D heterogeneous integration for mmWave/sub-THz systems, novel sub-THz GaN transistors, and advanced packaging technologies using DTCO/STCO. My research focuses on integrating GaN, Si CMOS, glass, and diamond substrates for next-generation RF systems.
With extensive experience in high-frequency device fabrication, circuit design, and advanced packaging, I work at the intersection of device physics, circuit design, and system integration. I maintain strong relationships with defense primes, national labs, and industry partners.
Key Achievements
- Best Student Award - ICNS-15Electronic Devices, 2025
- IEEE RFIC Best Student Paper Finalist2025
- NDSEG FellowshipNational Defense and Science Graduate, 2023
- IEEE MTT-S Graduate Fellowship2023
- 1st Place IMS PA Design CompetitionIEEE International Microwave Symposium, 2019
- Barry Goldwater Scholarship2021
View all honors & awards
- Intel Andy Grove Scholarship2020
- NSF Graduate Research FellowshipNational Science Foundation, 2023
- Qualcomm Innovation Fellowship Finalist2024
- Georgia Tech ECE Best Undergraduate Research2022
- Eagle Scout, Order of the Arrow (OA)Boy Scouts of America, 2018
- SRC Jump 2.0 CHIMES Best Poster2023, 2024 & 2025
Journey
Massachusetts Institute of Technology
Ph.D. in Electrical Engineering, GPA 5.00
Minor: Public Policy and Security Studies of Emerging Technologies
Massachusetts Institute of Technology
Master of Science in Electrical Engineering
Georgia Institute of Technology
Bachelor of Science in Electrical Engineering, GPA 3.60/4.00
Study Abroad - Georgia Tech Lorraine | Metz, France
MIT - Tomás Palacios Group & Ruonan Han Group
Graduate Research Assistant
IBM Quantum
Senior Quantum Research Scientist Intern
IBM Quantum
Quantum Research Scientist Intern
Raytheon - Advanced Technology Division
Part-Time Graduate Research Intern
Qorvo
R&D Intern
Publications
Integrated Circuit-on-Glass (ICoG): A Self-Packaged 3D-Heterogeneous Integration (3DHI) Platform for Millimeter-Wave Circuits With Embedded GaN-on-Si Dielets
IEEE Transactions on Microwave Theory and Techniques, January 2026
Pradyot Yadav, Xingchen Li, Tomás Palacios, Madhavan Swaminathan
3-D-Millimeter Wave Integrated Circuits (3D-mmWIC) Using GaN-on-Si Dielets With Si CMOS for 5G FR2 Power Amplifiers
IEEE Transactions on Microwave Theory and Techniques, 2026
Pradyot Yadav, Jinchen Wang, Patrick Darmawi-Iskandar, John Niroula, Ulrich L. Rohde, Ruonan Han, Tomás Palacios, and collaborators at Georgia Tech and Air Force Research Laboratory
3D-Millimeter Wave Integrated Circuit (3D-mmWIC): A Gold-Free 3D-Integration Platform for Scaled RF GaN-on-Si Dielets with Intel 16 Si CMOS
2025 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), June 2025 • Best Student Paper Finalist
Pradyot Yadav, Jinchen Wang, Patrick Darmawi-Iskandar, John Niroula, Ulrich L. Rohde, Ruonan Han, Tomás Palacios, and collaborators at Georgia Tech and Air Force Research Laboratory
First Demonstration of Highly Scaled RF GaN-on-Si Dielets Embedded in Glass Interposer
2025 IEEE/MTT-S International Microwave Symposium (IMS), June 2025
Pradyot Yadav, Xingchen Li, John Niroula, Patrick Darmawi-Iskandar, Ulrich L. Rohde, Tomás Palacios, Madhavan Swaminathan
Heterogeneously-Integrated Amplifier-on-Glass with Embedded Gallium Nitride (GaN) Dielet for mmWave Applications
2025 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), June 2025
Xingchen Li*, Pradyot Yadav*, Tomás Palacios, Madhavan Swaminathan
*Equal contribution
Record High Temperature Performance in Scaled AlGaN/GaN-on-Si HEMTs up to 500°C
2024 Device Research Conference (DRC), June 2024
Authors: John Niroula, Matthew A. Taylor, Qingyun Xie, Pradyot Yadav, Shisong Luo, Yuji Zhao, Tomás Palacios
High temperature stability of regrown and alloyed Ohmic contacts to AlGaN/GaN heterostructure up to 500 °C
Applied Physics Letters, Vol. 124, Issue 20, May 2024
Authors: John Niroula, Qingyun Xie, Nitul S. Rajput, Patrick K. Darmawi-Iskandar, Sheikh Ifatur Rahman, Shisong Luo, Rafid Hassan Palash, Bejoy Sikder, Mengyang Yuan, Pradyot Yadav, Gillian K. Micale, Nadim Chowdhury, Yuji Zhao, Siddharth Rajan, Tomás Palacios
First Demonstration of GaN RF HEMTs on Engineered Substrate
2023 Device Research Conference (DRC), June 2023
Pradyot Yadav, Qingyun Xie, John Niroula, Gillian K. Micale, Hemant Pal, Tomás Palacios
Towards DTCO in High Temperature GaN-on-Si Technology: Arithmetic Logic Unit at 300 °C and CAD Framework up to 500 °C
2023 IEEE Symposium on VLSI Technology and Circuits, June 2023
Qingyun Xie, Mengyang Yuan, John Niroula, Bejoy Sikder, Shisong Luo, Kai Fu, Nitul S. Rajput, Ayan Biswas Pranta, Pradyot Yadav, Yuji Zhao, Nadim Chowdhury, Tomás Palacios
Optimizing the Doherty Amplifier: Design of a 3-GHz GaN Doherty Amplifier Achieving 60% Efficiency
IEEE Microwave Magazine, February 2020 • 1st Place, IMS 2019 PA Student Design Competition
Pradyot Yadav
In the News
New 3D chips could make electronics faster and more energy-efficient
MIT News • June 18, 2025
Lead author Pradyot Yadav: “We've combined the best of what exists in silicon with the best possible gallium nitride electronics. These hybrid chips can revolutionize many commercial markets.”
MIT-led team develops low-cost, scalable process for integrating GaN transistors onto silicon CMOS chips
Semiconductor Today • June 2025
Coverage of breakthrough 3D-mmWIC technology for heterogeneous integration of GaN and silicon CMOS.
New 3D chips could make electronics faster and more energy-efficient
Silicon Semiconductor • Video Interview • 2025
Video interview with Pradyot Yadav discussing the scalable, low-cost fabrication process for integrating GaN transistors onto silicon CMOS chips.
MIT's New 3D Chips Could Make Electronics Faster and More Energy-Efficient
SciTechDaily • June 2025
Feature on gold-free 3D integration platform for scaled RF GaN-on-Si dielets with Intel 16 Si CMOS.
MIT reveals 3D mmWave GaN on CMOS tech
Compound Semiconductor News • 2025
Technical analysis of the copper-bonding approach for integrating GaN dielets with silicon CMOS.
MIT Researchers Integrate Gallium Nitride Transistors onto Silicon Chips for Enhanced Electronics
Impact Lab • June 25, 2025
Discussion of applications in wireless transmitters, quantum computing, and defense technology.
New Hybrid Integration Technology Promises GaN-on-Si at Scale
Embedded.com • July 2025
In-depth interview discussing the scalability and commercial applications of the new integration process.
Research Bits: July 1
Semiconductor Engineering • July 2025
Featured research on 3D heterogeneous integration for next-generation electronics.
Outstanding Students Honored at Annual Celebration
Georgia Tech News Center • May 11, 2022
Pradyot Yadav honored for outstanding undergraduate research in electrical and computer engineering.
Electrical Engineering Student Pradyot Yadav Wins 2021 Barry Goldwater Scholarship
Georgia Tech ECE • April 2021
Yadav named one of three Georgia Tech students to win the prestigious Goldwater Scholarship. Quote: “My being awarded this scholarship marks the start of a career focused on the cutting edge in RF/mmWave research.”
Three Engineering Students Win 2021 Barry Goldwater Scholarship
Georgia Tech College of Engineering • April 2021
Pradyot Yadav recognized as one of only 410 scholars selected nationwide from over 1,250 nominated STEM students.
Yadav Wins Top Student Design Prize at IMS
Georgia Tech ECE • June 2019
Rising sophomore Pradyot Yadav wins first place in RF Power Amplifier Design at the 2019 International Microwave Symposium, competing against seniors and graduate students from top institutions.
North Penn Science, Tech Students Excel at Local Competitions
Patch.com • 2016
Pradyot Yadav awarded 1st place in Engineering and received the IEEE Engineering Award at local science competition.
Skills & Expertise
Device Fabrication
Circuit Design
Advanced Packaging
Software & Tools
EDA Tools
PDKs
Programming
Languages
Hardware
Instrumentation
Languages
Let's Connect
I'm always interested in discussing new opportunities, collaborations, or research projects.